| 微结构三维形貌无损检测的双波段显微干涉技术 |
| Dual-band microscopic interferometry for nondestructive testing of three-dimensional morphology of microstructures |
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| 中文摘要: |
| 功能型微结构具有调控光场或调控电子导通等功能，一般包含具有规则的几何形状，基于深度和线宽的比值，可以将其区分为高/低深宽比微结构。目前对微结构的检测，多用有损检测中的扫描电镜（SEM）剖面成像技术，而产线上迫切需要用于监测与改进制作工艺的无损检测技术。本文系统总结了作者所在研究团队十余年在微结构三维形貌无损检测方面的低相干显微干涉技术进展，其中白光显微干涉仪用于超光滑表面、台阶、微光学元件、微机械元件等低深宽比微结构的三维形貌检测，近红外显微干涉仪用于硅基高深宽比微结构的三维形貌检测。文章阐述了两波段显微干涉系统的关键技术与典型样品的检测实例，结果表明：白光显微干涉仪和近红外显微干涉仪是两种高精度的无损检测仪器，前者检测高深宽比小于等于4，后者检测高深宽比大于等于20的微结构三维形貌，数据结果是可信的。显微干涉无损检测技术获取的三维形貌数据，将有效优化微结构的制造工艺，进一步提升有关器件的性能。 |
| 英文摘要: |
| Functional microstructure has the function of regulating light field or electronic conduction, and generally contains regular geometric shapes. Based on the ratio of depth to line width, it can be divided into high/low-aspect-ratio microstructures. At present, the detection of the geometric characteristic parameters of the microstructure is mainly conducted by SEM, which belongs to the destructive detection. The production line urgently needs non-destructive testing technology to monitor and improve its manufacturing process. This article systematically summarizes the progress made by the author's research team in the low-coherence microscopic-interference technology for nondestructive testing of three-dimensional (3D) morphology of microstructures in the past ten years. The white light microscopic interferometer is used to detect the 3D topography of ultra-smooth surfaces, steps, micro optical elements, micro mechanical elements and other low aspect ratio microstructures. A near-infrared micro interferometer is used to detect the 3D morphology of silicon based high aspect ratio microstructures. In this paper, the key technologies of the two band microscopic interference system and the tests of typical samples are described. The results show that white light micro interferometer and near-infrared micro interferometer are two kinds of high-precision nondestructive testing instruments. They can detect the 3D morphology of the microstructures with aspect ratio ≤4, and ≥20, respectively. The 3D topography data obtained by the microscopic-interference nondestructive testing technology will effectively promote the optimization of the manufacturing process of the microstructure and the further improvement of the performance of related devices. |
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| 中文关键词: 无损测量 显微干涉法 低相干 三维形貌 微纳器件 |
| 英文关键词:nondestructive measurement microscopic interferometry low coherence three-dimensional topography micro-nano device |
| 基金项目: |
| DOI：10.11823/j.issn.1674-5795.2023.01.06 |
| 引用本文：霍霄, 高志山, 袁群, 郭珍艳, 朱丹.微结构三维形貌无损检测的双波段显微干涉技术[J].计测技术,2023,(1):. |
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